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Amaoe HW9 BGA Reballing Schablone Kirin710 Hi6260 Für Honor 8X/20i/10/20 Lite/Nova 5i/4e/3i Maimang 7 8 eMMC CPU RAM IC Stahl Mesh

USD 3.50

Amaoe HW9 BGA Reballing Schablone Kirin710 Hi6260 Für Honor 8X/20i/10/20 Lite/Nova 5i/4e/3i Maimang 7 8 eMMC CPU RAM IC Stahl Mesh

Description
Specification
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