+

BGA Reballing Stencil Kit For HUAWEI XIAOMI Sanmsung MTK OPPO WTR LG CPU IC Chip Tin Planting Soldering Android Solder Template

USD 5.47USD 7.30

BGA Reballing Stencil Kit For HUAWEI XIAOMI Sanmsung MTK OPPO WTR LG CPU IC Chip Tin Planting Soldering Android Solder Template

Description
Specification
(5 stück) 3W = 2E 3W = QFN
USD 15.56USD 16.38
+